JEBAT

JEBAT is a high-performance, non-curing thermal paste engineered with a hybrid Metal Oxide and graphene filler system, delivering high thermal conductivity while maintaining long-term stability and easy reworkability.

Designed for enthusiasts, system builders, and professional users, JEBAT provides reliable heat transfer without curing or hardening, making it ideal for CPUs, GPUs, and electronics that require periodic maintenance or upgrades.

Performance Highlights

• Consistent performance over time
  Unlike curing or phase-change materials, JEBAT remains a stable paste, ensuring consistent contact resistance and easy removal when upgrading or servicing hardware.

• Hybrid filler design
  Aluminium oxide provides safe electrical insulation and durability, while rGO enhances heat spreading for improved overall thermal efficiency.

Key Advantages

• Average thermal conductivity: 24 W/m·K
• Non-curing and reworkable
• Electrically insulating and safe around components
•  Excellent spreadability and surface wetting
• Low pump-out and oil separation
•  Long-term stability under thermal cycling

Specification

• • Thermal conductivity             24 W/m·K
  • Material system                      Aluminium oxide + Graphene
  • Form                                       Non-curing paste
  • Operating temperature          −40°C to 180°C
  • Electrical behavior                  Electrically insulating
  • Viscosity                                  2107.794 Pa·s (Medium–high, non-sag)
  • Pump-out resistance              High
  • Dry-out resistance                  High
  • Application method               Syringe / spatula
  • Shelf life                                  12 months (sealed storage)
  • Reworkability                         Yes
  • Volume                                   2g precision syringe